Thermal Resistance for Integrated Circuits

Windchill Risk and Reliability Desktop Help > Windchill Prediction > Prediction Part Data > Prediction Data Pane > Calculate Thermal Resistance Window > Thermal Resistance for Integrated Circuits

The Thermal Resistance button is shown in the Prediction Data pane for an integrated circuit when one of the following models for parts stress analysis is selected:

• MIL-HDBK-217 FN2

• MIL-HDBK-217 FN1

• IEC TR 62380

• RDF 2000

• HRD5

• FIDES 2009

• FIDES 2004

• 299C Parts Stress

• 299B Parts Stress

When the Thermal Resistance button is shown, a thermal resistance must be specified for the integrated circuit. The preferred method for evaluating thermal resistance is to enter the thermal resistance value specified or published by the manufacturer for Thermal Resistance, which appears n the lower left side of the Prediction Data pane. However, this value is not always available. In this case, click Thermal Resistance to open the Calculate Thermal Resistance window. In it, you enter the parameter values to use to compute the thermal resistance for the integrated circuit.

The following table describes the parameters that appear in the Calculate Thermal Resistance window for integrated circuit when most models are selected. When a FIDES model for parts stress analysis is selected, the parameters for calculating thermal resistance for an integrated circuit are those described in Thermal Resistance for a FIDES Integrated Circuit.

Parameter	Data Type	Description
# of Pins	Numeric - Integer	The number of active pins in the package. The default is the value entered for Pins in the Prediction Data pane.
Resistance Type	Predefined List	Indicates whether resistance is based on case temperature or ambient temperature.
Cooling Type	Predefined List	The method for cooling the integrated circuit. This parameter is available only if the resistance is based on ambient temperature.
Package Type	Predefined List	The type of package for the integrated circuit. The package types use the terminology from the IEC TR 62380 and RDF 2000 models. When either the IEC TR 62380 or RDF 2000 model is selected, this parameter is display-only. It shows the package type specified in the Prediction Data pane for the part.

After you specify values for these parameters and click Calculate, the thermal resistance of the integrated circuit is computed. Thermal Resistance, which appears on the lower right side in the Prediction Data pane, shows the result. For more information, see Thermal Resistance Calculations for Integrated Circuits.