Prediction FIDES Lead Free Factor Files
When you have a FIDES license, you can create any number of Prediction FIDES Lead Free Factor files. However, you can use these files only with a FIDES 2009 model. No other model, including the FIDES 2004 model, supports reliability modeling of lead free assemblies. According to the FIDES 2009 standard, FIDES Guide 2009, Reliability Methodology for Electronic Systems, transitions to lead free solder assemblies have an influence on the reliability of the system due to:
• The modifications of manufacturing processes and materials
• The changes in the accelerations of some failure mechanisms
A Prediction FIDES Lead Free Factor file stores the questions and answers for the Pi lead free factor that a FIDES 2009 model uses to support reliability modeling of a lead free assembly.
The following topics provide comprehensive information about these files: