|
Parameter
|
Type
|
Description
|
|---|---|---|
|
Type
|
Choice List [Parts Count also]
|
The type of device. Choices vary by model.
|
|
Technology Type
|
Choice List [Parts Count also]
|
The technology type of the device. Choices vary by subcategory.
|
|
Manufacturing Process
|
Choice List [Parts Count also]
|
The type of manufacturing process. Choices are:
• Non QML/QPL
• QML/QPL
|
|
Feature Size
|
Real [Parts Count also]
|
The feature size of the device. The units are microns. Common values range from 1.0 to 2.5.
|
|
Dissipation Surface
|
Real [Parts Count also]
|
The dissipation surface area of the device. The units are square centimeters. Common values range from 0.1 to 3.0.
|
|
ESD Susceptibility
|
Integer [Parts Count also]
|
The voltage that causes the part to fail. Common values range from 0 to 16,000. If the value is unknown, use 0.
|
|
Seal
|
Choice List [Parts Count also]
|
The type of package seal. Choices are:
• Hermetic
• Non-Hermetic
|
|
Quality Level
|
Choice List
|
The quality screening level used in the manufacturing of the device. Choices are:
• S
• B
• B-1
• Commercial
• Commercial, unknown pedigree
If the device is screened to custom or intermediate programs, you can enter a Pi Q value directly in Pi Q Value. For more information, see MIL-HBDK-217 Quality Levels.
|
|
Pins
|
Integer [Parts Count also]
|
The number of active pins in the package.
|
|
Package Type
|
Choice List [Parts Count also]
|
Indicates how the chip is packaged. Choices vary by model.
|
|
Years in Production
|
Choice List [Parts Count also]
|
The number of years the device has been in production. Choices are:
• >=2.0
• 1.5
• 1.0
• 0.5
• <=0.1
|
|
[Temperature Parameters]
|
---
|
For more information, see Comprehensive Temperature Parameters.
|
|
[Derating Parameters]
|
---
|
For more information, see Derating Parameters.
|