Parameter
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Type
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Description
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Type
|
Choice List
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The type of device. Choices vary by subcategory. The selection made in this field determines which of the various # of parameters appear in the Prediction Data pane.
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Package Type
|
Choice List
|
The type of package. Choices vary by subcategory.
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Electrical Environment
|
Choice List
|
The general environment in which the device is used.
|
Mounting Substrate
|
Choice List
|
The type of substrate on which the device is mounted. Choices are:
• Cu/Invar/Cu
• Epoxy Glass
• Flexible
• PFTE Glass
|
Year of Manufacture
|
Integer
|
The four-digit year in which the device was manufactured (such as 1998 or 2004).
|
# of Transistors
|
Integer
|
Required only for certain types of subcategories.
The number of active transistors in the package. You can determine the transistor count from the logic diagram.
|
# of Gates
|
Integer
|
Required only for certain types of subcategories.
The number of active gates in the package. You can determine the gate count from the logic diagram. A J-K or R-S flip flop is equivalent to 6 gates when used as part of an LSI circuit. A gate is considered to be any one of the following functions: AND, OR, exclusive OR, NAND, NOR, and inverter. When a logic diagram is not available, use a device transistor count to determine gate count.
|
# of Bits
|
Integer
|
Required only for certain types of subcategories.
The number of bits in the memory device. This parameter is used in conjunction with Units to enter the memory device bits.
|
Units
|
Choice List
|
Required only for certain types of subcategories.
The units for the # of Bits value. Choices are:
• b (bits)
• Kb (1024 bits)
• Mb (1,048,576 bits)
• Gb (1,073,741,824 bits)
The default is Kb. However, you can enter the unit in many ways. For example, for a 1-kilobit memory chip, you can enter a 1 for # of Bits and select Kb for Units, or you can enter 1024 for # of Bits and select b for Units.
|
# of Program Points
|
Integer
|
Required only for certain types of subcategories.
The number of program points in the package. The IEC TR 62380 and RDF 2000 models separate EEPROM and Flash memory devices because they cannot be programmed bit by bit but rather are programmed in groups of bits. According to these standards, for EEPROM devices, you can erase blocks of words or individual words. For Flash devices, like thumb drives for computers, you can erase the whole memory array or blocks of words. While the standards do not explicitly define a program point, it is assumed that it is the number of groups of bits that can be written to and erased together. Data sheets may refer to this group of bits as words, blocks, or array.
|
# of Macrocells
|
Integer
|
Required only for certain types of subcategories.
The number of macrocells in the package.
|
Pins
|
Integer
|
The number of active pins in the package.
|
Surface Mounted Device
|
Checkbox
|
Required only for the IEC TR 62380 model.
Indicates whether the device is surface mounted.
|
Surface Mounted Package Type
|
Choice List
|
Required only for the IEC TR 62380 model.
The manner used to surface mount the device.
|
Package Diagonal
|
Numeric
|
Required only for the IEC TR 62380 model.
The diagonal measurement of the package in millimeters.
|
[Temperature Parameters]
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For more information, see Comprehensive Temperature Parameters.
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[Derating Parameters]
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For more information, see Derating Parameters.
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