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The FIDES 2004 model does not support the High Stability Bulk Metal Foil Precision subcategory. Only FIDES 2009 models support this subcategory.
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Parameter
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Type
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Description
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[Standard FIDES Parameters]
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For more information, see FIDES Standard Part Parameters.
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Type
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Choice List
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Required only by the FIDES 2009 model for the High Stability Bulk Metal Foil Precision subcategory.
The method by which the device is mounted. Choices are:
• SMD (for a surface-mounted device)
• Through Hole
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Resistance
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Real
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Required only by the FIDES 2009 model for the High Stability Bulk Metal Foil Precision subcategory.
The resistance value of the device. This parameter is used in conjunction with Units to enter the resistance units.
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Units
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Choice List
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Required only by the FIDES 2009 model for the High Stability Bulk Metal Foil Precision subcategory.
The units for the Resistance value. Choices are:
• ohm
• Kohm (ohm * 1000)
• Mohm (ohm * 1E6)
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Dissipation
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Choice List (Parts Count only)
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Required only by the FIDES 2009 Parts Count model for the following subcategories: Lower Power Film (Minimelf), Low Power Wirewound Precision, Power Film, and Power Wirewound.
Indicates whether the device is high or low in power dissipation.
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Resistor Network
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Checkbox
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For the FIDES 2004 model only, required for all but the SMD Resistive Grid subcategory.
Indicates whether the device is a series of resistors connected in series or parallel.
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Resistor Quantity
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Integer
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For the SMD Resistive Grid subcategory, this parameter is always available. For the FIDES 2004 model only, for other subcategories, it is available only when Resistor Network is selected.
The number of resistors in the network or grid. Do not include resistors that are not used.
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[Power Parameters]
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Real
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For more information, see Power Parameters.
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[Derating Parameters]
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For more information, see Derating Parameters.
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