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Parameter
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Type
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Description
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|---|---|---|
|
[Standard FIDES Parameters]
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For more information, see FIDES Standard Part Parameters.
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# of Layers
|
Integer
|
The number of layers in the PCB.
|
|
Type
|
Choice List [Parts Count and Families Count only]
|
The method by which the device is mounted. Choices are:
• Surface Mount
• Through Hole Mount
|
|
# of Mounting Points
|
Integer [Parts Count and Families Count also]
|
The number of mountings points for leads, which is the total of both surface-mounted and through-hole mounts.
|
|
Routing Class
|
Choice List
|
Required only by the FIDES 2004 model.
The way in which the board electrically connects components using conductive pathways. Choices are Class 1 through Class 6.
|
|
Min Conductor Width / Spacing
|
Choice List (μm)
|
Required only by the FIDES 2009 model.
The minimum spacing between conductors or pads. Many choices are available. Consider the zone, or for a multi-layer PCB, consider the layer, with the highest density.
|
|
[Derating Parameters]
|
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For more information, see Derating Parameters.
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