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Parameter
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Type
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Description
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|---|---|---|
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[Standard FIDES Parameters]
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For more information, see FIDES Standard Part Parameters.
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Type
|
Choice List [Parts Count and Families Count also]
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The type of device. Choices vary by subcategory.
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|
Secondary Type
|
Choice List [Parts Count and Families Count also]
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Required only for the Semiconductor subcategory for the following types: Low Power Transistors and Power Transistors.
The subtype of the device. Choices vary by type.
|
|
Material
|
Choice List [Parts Count and Families Count also]
|
Required only for the Integrated Circuit subcategory and the Semiconductor subcategory for the Low Power Diodes type.
The material for the device. Choices are:
• AsGa
• Si
• SiGe
|
|
Case Type
|
Choice List [Parts Count and Families Count also]
|
Not required for the Passive subcategory.
The type of case surrounding the device. Choices vary by subcategory.
|
|
Pins
|
Integer [Parts Count and Families Count also]
|
Required only for the Integrated Circuit subcategory.
The number of active pins in the package.
|
|
[Temperature Parameters]
|
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For more information, see Temperature Parameters. Current Parameters
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|
[RF and HF Process Grade Questions]
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Choice List [Parts Count and Families Count also]
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When using a FIDES 2009 model, the information you provide about process-related factors is used to adjust the base failure rate calculated by the model. For more information, see Process Grade Questions for RF and HF Microwave Components.
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|
[Derating Parameters]
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For more information, see Derating Parameters.
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