Assembly Forms

Windchill Risk and Reliability Desktop Help > Windchill Prediction > Prediction Interface > Prediction Panes > Assembly Forms

Assembly Forms

The Prediction forms for specifying data about the active assembly in the System Tree Items table are described in the following table.

Pane

Description

General Data

Specifies basic information about the assembly. For more information, see General Data Pane (Assembly).

Calculation Data

Specifies parameters required to perform a prediction for the assembly. The form shown in this pane depends on the model selected for the assembly. For more information, see Calculation Data Pane.

Allocation

Specifies allocation parameters for the assembly. The Allocation pane is present only if Allocated is selected for Failure rate type in the assembly’s Calculation Data pane. The form shown in the Allocation pane depends on the allocation method selected under Prediction in the System file properties. For more information, see Allocation Pane (Assembly).

Hybrid

Specifies parameters for additional hybrid calculations. The Hybrid pane is present only when Hybrid is selected in the General Data pane for the assembly. This checkbox is unavailable if the 217Plus, PRISM, or Siemens model is selected because none of these models supports hybrid calculations. The form shown in the Hybrid pane depends on the model selected for the assembly. For more information, see Hybrid Pane.

Method Data

Specifies burn-in, laboratory, or field data to take into account in the prediction for the assembly. When a Telcordia model is selected or inherited in an assembly’s Calculation Data pane, the Method Data pane is shown. If you change the model, this pane remains visible so that you can use Telcordia calculation methods with other models. The options available in this pane depend on the type of data to take into account. For more information, see Method Data Pane (Assembly).

PCB Data

Specifies parameters required for additional PCB (Printed Circuit Board) calculations. The PCB Data pane is present only when PCB is selected in the General Data pane for the assembly. This checkbox is available only if the IEC TR 62380 or RDF 2000 model is selected because only they support PCB calculations in this manner. For more information, see PCB Data Pane.

FIDES models support a Printed Circuit Board part category. For more information, see Entering FIDES Printed Circuit Boards.

Predecessor

Specifies parameters required for performing predecessor analysis. The Predecessor pane is shown only when the 217Plus or PRISM model is selected for the assembly. However, predecessor analysis can be used with other models. For more information, see Process Grade Pane.

Process Grade

Specifies the Prediction Process Grade file to apply to the assembly and shows the Π (Pi) factors for this file. The Process Grade pane is shown only when a 217Plus or PRISM model is selected for the assembly. However, Prediction Process Grade files can be used with other models. For more information, see Process Grade Pane.