|
Parameter
|
Type
|
Description
|
|---|---|---|
|
[Standard FIDES Parameters]
|
---
|
For more information, see FIDES Standard Part Parameters.
|
|
Technology
|
Choice List
|
Required only for the ASIC subcategory, which is supported only by FIDES 2009 models.
The type of material. Choices are:
• Bipole Silicon, BICMOS
• MOS Silicon
|
|
Type
|
Choice List [Parts Count]
|
For FIDES 2009 models, required only for the ASIC subcategory.
The type of device. Choices vary by technology for the FIDES 2009 model for parts stress. For the FIDES 2009 Parts Count model, choices indicate whether the device is a simple or complex ASIC circuit.
For the FIDES 2004 model, required only for the following subcategories: Digital Circuit and Linear Circuit.
The type of material. Choices vary by subcategory.
|
|
Case Type
|
Choice List
|
The type of case surrounding the device. Dozens of choices are available.
|
|
Package Type
|
Choice List [Parts Count and Families Count only]
|
Indicates how the device is packaged. Choices are:
• Hermetic
• Non-Hermetic
|
|
Pins
|
Integer [Parts Count and Families Count also]
|
The number of active pins in the package.
|
|
[Temperature Parameters]
|
---
|
For more information, see Basic Temperature Parameters.
|
|
[ASIC Process Grade Questions]
|
Checkboxes
|
When using the FIDES 2009 model for parts stress analysis, the information you provide information about process-related factors is used to adjust the base failure rate calculated by the model. For more information, see Process Grade Questions for ASIC Integrated Circuits.
|
|
[Derating Parameters]
|
---
|
For more information, see Derating Parameters.
|