Microelectronic Hybrid Devices
Table A-48 through Table A-55 provide information for microelectronic hybrid devices.
Table A-48. Die Correction Factors
Component
Applicable to:
KG
Integrated Circuits
All Linear devices,
0.6
Digital devices
< than 400 gates,
and Memories <
4000 bits
All Digital devices
0.8
400 gates
Memories > 4000
0.4
bits
Transistors
0.4
Diodes
0.2
Capacitor Chips
0.8
Table A-49. Base Failure Rates for Chip and Substrate Resistors
Temperature of Hybrid Package
°C
Base Failure Rate
λr
Below 50 °C
0.00010
51 °C - 80 °C
0.00015
81 °C - 100 °C
0.00020
101 °C - 125 °C
0.00025
126 °C - 150 °C
0.00030
Table A-50. Base Failure Rates for Interconnections in a Hybrid Device
Hybrid Package Temperature
°C
Base Failure Rate λr per 106 hours per bond
Bi-metal Bonds (Gold/Aluminium)
Single Metal Bonds (Aluminium/Aluminium) Gold/Gold or Solder)
25
0.000174
0.000174
30
0.000230
0.000218
35
0.000302
0.000271
40
0.000394
0.000334
45
0.000508
0.000410
50
0.000650
0.000499
55
0.000826
0.000604
60
0.00104
0.000727
65
0.00130
0.000871
70
0.00162
0.00103
75
0.00201
0.00123
80
0.00247
0.00145
85
0.00302
0.00170
90
0.00367
0.00199
95
0.00444
0.00231
100
0.00534
0.00268
105
0.00639
0.00310
110
0.00762
0.00356
115
0.00904
0.00409
120
0.0106
0.00467
125
0.0125
0.00531
130
0.0147
0.00603
135
0.0171
0.00682
140
0.0199
0.00770
145
0.0231
0.00866
150
0.0266
0.00971
* 
If metal system is unknown, assume bi-metal bonds.
Table A-51. Base Failure Rates for Hybrid Packages
Package Temperature °C
Seal Perimeter (inches)
25 °C
70 °C
30 °C
90 °I
35 °C
90 °I
40 °C
100 °C
45 °C
110 °C
50 °C
120 °C
55 °C
130 °C
60 °C
140 °C
65 °C
150 °C
1.75
0.0011
0.0113
0.0015
0.0174
0.0020
0.0261
0.0026
0.0383
0.0034
0.0551
0.0044
0.0778
0.0056
0.1081
0.0072
0.1478
0.0090
0.1990
2.00
0.0017
0.0167
0.0023
0.0257
0.0030
0.0385
0.0039
0.0566
0.0051
0.0815
0.0065
0.1151
0.0084
0.1599
0.0106
0.2186
0.0134
0.2944
2.25
0.0024
0.0235
0.0032
0.0362
0.0042
0.0543
0.0055
0.0798
0.0071
0.1148
0.0092
0.1622
0.0118
0.2253
0.0149
0.3079
0.0188
0.4148
2.50
0.0032
0.0319
0.0043
0.0491
0.0057
0.0736
0.0075
0.1081
0.0097
0.1556
0.0125
0.2199
0.0160
0.3054
0.0202
0.4175
0.0255
0.5642
2.75
0.0042
0.0420
0.0057
0.0645
0.0075
0.0968
0.0098
0.1421
0.0127
0.2045
0.0164
0.2890
0.0210
0.4014
0.0266
0.5487
0.0335
0.7390
3.00
0.0054
0.0537
0.0073
0.0825
0.0096
0.1239
0.0126
0.1819
0.0163
0.2618
0.0210
0.3700
0.0268
0.5138
0.0341
0.7024
0.0429
0.9461
3.25
0.0068
0.0673
0.0091
0.1034
0.0120
0.1551
0.0157
0.2278
0.0204
0.3279
0.0263
0.4633
0.0336
0.6435
0.0427
0.8797
0.0537
1.1848
3.50
0.0084
0.0827
0.0112
0.1270
0.0147
0.1906
0.0193
0.2800
0.0251
0.4030
0.0323
0.5694
0.0413
0.7908
0.0524
1.0810
0.0660
1.4560
3.75
0.0101
0.0999
0.0135
0.1536
0.0178
0.2305
0.0233
0.3384
0.0303
0.4871
0.0391
0.6883
0.0499
0.9559
0.0634
1.3067
0.0798
1.7600
4.00
0.0120
0.1191
0.0161
0.1830
0.0212
0.2746
0.0278
0.4032
0.0361
0.5804
0.0465
0.8201
0.0595
1.1390
0.0755
1.5569
0.0951
2.0971
4.50
0.0165
0.1629
0.0220
0.2503
0.0291
0.3757
0.0381
0.5517
0.0494
0.7940
0.0637
1.1219
0.0814
1.5582
0.1033
2.1300
0.1301
2.8690
5.00
0.0216
0.2138
0.0287
0.3286
0.0381
0.4932
0.0500
0.7242
0.0649
1.0424
0.0836
1.4728
0.1069
2.0456
0.1356
2.7963
0.1708
3.7663
5.50
0.0275
0.2713
0.0366
0.4170
0.0484
0.6258
0.0634
0.9191
0.0823
1.3228
0.1061
1.8691
0.1356
2.5959
0.1721
3.5485
0.2168
4.7795
6.00
0.0339
0.3347
0.0452
0.5143
0.0597
0.7720
0.0782
1.1336
0.1016
1.6317
0.1308
2.3054
0.1673
3.2020
0.2122
4.3770
02674
5.8954
6.50
0.0408
0.4030
0.0544
0.6193
0.0719
0.9295
0.0942
1.3650
0.1223
1.9646
0.1575
2.7759
0.2014
3.8554
0.2555
5.2702
0.3220
7.0985
7.00
0.0481
0.4753
0.0642
0.7304
0.0848
1.0962
0.1111
1.6097
0.1442
2.3170
0.1858
3.2737
0.2375
4.5468
0.3014
6.2153
0.3797
8.3714
7.50
0.0557
0.5505
0.0743
0.8460
0.0982
1.2697
0.1286
1.8646
0.1671
2.6838
0.2152
3.7920
0.2751
5.2666
0.3491
7.1993
0.4398
9.6968
8.00
0.0635
0.6277
0.0847
0.9647
0.1120
1.4478
0.1467
2.1262
0.1905
3.0603
0.2454
4.3239
0.3137
6.0055
0.3491
8.2093
0.4398
11.0572
Table A-52. Circuit Function Factors
Type of Hybrid Circuit
Circuit Function Factor KF
Digital
1.0
Linear or Linear- Digital Combination
1.25
Table A-53. Environmental Factors For Resistors, Interconnections and Packages in a Hybrid Device
Operational
Environment
(See Note1 below)
KE
Ground Fixed
G1
1.0
Ground Mobile
G2
2.0
Ship Protected
S1
2.0
Ship Exposed
S2
3.0
Air Protected
A1
3.0
Air Exposed
A2
36.0
* 
The environments are described in Table A-57.
Table A-54. Quality Factors for a Hybrid Device
Screening Level
BS 9000
S1
S2
S3
S4
Full Assessment
Quality Factors, KQ
0.5
1.0
2.5
5.0
8.0
Table A-55. Density Factors for a Hybrid Device
Density Factors ( KD ) for a Hybrid Device
Density = N-----u---m---b--e---r----o---f---I--n---t--e---r--c--o--n---n--e---c---t-i--o---n---s-
AS + 0.10
Where AS = area of substate (sq. inches)
KD = 0.2 + 0.15 Density
Density
KD
Density
KD
15
0.78
160
2.10
20
0.87
165
2.13
25
0.95
170
2.16
30
1.02
175
2.18
35
1.09
180
2.21
40
1.15
185
2.24
45
1.21
190
2.27
50
1.26
195
2.29
55
1.31
200
2.32
60
1.36
205
2.35
65
1.41
210
2.37
70
1.45
215
2.40
75
1.50
220
2.42
80
1.54
225
2.45
85
1.58
230
2.47
90
1.62
235
2.50
95
1.66
240
2.52
100
1.70
245
2.55
105
1.74
250
2.57
110
1.77
255
2.60
115
1.81
260
2.62
120
1.84
265
2.64
125
1.88
270
2.66
130
1.91
275
2.69
135
1.94
280
2.71
140
1.97
285
2.73
145
2.01
290
2.75
150
2.04
295
2.78
155
2.07
300
2.80
Note: The density parameter is intended as a measure of the mechanical complexity of the hybrid microcircuit as a whole.