Bonded Interfaces
Use the Bonded interface to connect the components or surfaces that touch each other and act as if they are bonded and stuck together. Loads between bonded components are transferred through their common interface and components bonded together will never separate from each other. The components connected with bonded always touch each other during analysis. During meshing, the coincident nodes on these components merge.
You can create a Bonded interface in Structure and Thermal mode.
In Native mode, you can create Bonded interface only between mating surfaces. If you select Surface-Surface reference type and select two surfaces that are not touching, Creo Simulate displays an error message after you click OK on the Interface Definition dialog box.
In FEM mode, you can connect non-matting surfaces also using Bonded interface. You can create rigid links instead of merging the nodes. When you select Bonded as a Type of interface on the Interface Definition dialog box, Creo Simulate selects the Merge Coincident Nodes check box in the Properties section. If you clear this check box, Creo Simulate creates links between coincident nodes on two bonded surfaces.
When you create a
Bonded interface between any two surfaces in an assembly,
Creo Simulate automatically creates a
force measure to calculate the magnitude of resultant force over the bonded interface. When you create a
Bonded interface between any two surfaces in Thermal mode,
Creo Simulate automatically creates a heat transfer rate measure to calculate the rate of total heat transfer over the bonded interface.