
|
Package Type
|
Junction-Case Thermal Resistance
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Junction-Ambient Thermal Resistance
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|---|---|---|
|
DIL ceramic
|
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|
DIL plastic
|
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|
PLCC plastic
|
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|
SOJ and SOL plastic
|
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|
TSOP plastic
|
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|
PGA ceramic
|
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|
QFP plastic
|
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|
BGA plastic
|
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|
Method
|
V(m/s)
|
K
|
|---|---|---|
|
Natural convection
|
0.15
|
1.4
|
|
Slightly assisted cooling
|
0.5
|
1.2
|
|
Fan-assisted cooling
|
1.0
|
1.0
|
|
Forced cooling
|
4.0
|
0.7
|