The 217Plus model is based on RIAC-HDBK-217Plus, Handbook of 217Plus Reliability Prediction Models. This standard was published in May 2006 by the Reliability Information Analysis Center (RIAC), a Department of Defense Information Analysis Center sponsored by the Defense Technical Information This model supersedes the PRISM model. It now incorporates all of the major component categories found in MIL-HDBK-217 models and supports both parts count and parts stress predictions. Information about entering part parameters for this model appears in 217Plus Part Parameters.

The 299 models are based on the GJB/z 299B and GJB/z 299C publications of the Chinese standard, Reliability Prediction Model for Electronic Equipment. These models are similar to MIL-HDBK-217 models, supporting the ability to perform both parts count and parts stress predictions. In addition to supporting more parts than the 299B model, the 299C model provides alternate parts count and parts stress predictions for components from foreign manufacturers. Information about entering part parameters for these models appears in 299B Part Parameters and 299C Part Parameters.

The FIDES models are based on the following publications published by the FIDES Group: FIDES Guide 2004 Issue A, Reliability Methodology for Electronic Systems and FIDES Guide 2009, Reliability Methodology for Electronic Systems. The base failure rates calculated by a FIDES model are always adjusted by Π (Pi) factors for process grades, application factors, and ruggedized factors to take non-component variables into account. The FIDES 2009 model can also adjust base failure rates by Π factors for lead free factors. The FIDES 2009 model supports families count, parts count, and parts stress, predictions. FIDES models cannot be mixed with other models or use methods supplied by other models. A FIDES model can only be selected for the top-most assembly. In this case, any model override selections for lower-level assemblies are ignored. Other than Prediction FIDES support files, FIDES models support only Prediction Derating and Defaults files. They do not support Prediction Values Library files or the use of Mission Profile files for mission calculations. Information about entering part parameters for these models appears in FIDES Part Parameters.

The HRD5 model is based on the Handbook for Reliability Data for Electronic Components used in Telecommunications Systems. Developed by British Telecommunications plc, this standard provides part models for a wide range of electronic components. Information about entering part parameters for this model appears in HRD5 Part Parameters.

The IEC TR 62380 model is based on the IEC TR 62380 standard, Reliability Data Handbook - Universal Model for Reliability Prediction of Electronic Components, PCBs, and Equipment Reliability Data Handbook - Universal Model for Reliability Prediction of Electronic Components, PCBs, and Equipment, published by the International Electrotechnical Commission (IEC). This model has only a few numeric differences from the earlier RDF 2000 model, which is based on the UTE C 80-810 standard published by the Union Technique de l’Electricite et de la Communication. Both models use cycling profiles and their applicable phases as a basis for failure rate calculations. These models, which replaced the earlier CNET 93 model, cannot be mixed with other models or use methods supplied by other models. The IEC TR 62380 or RDF 2000 model can only be selected for the top-most assembly. In this case, any model override selections that might exist for lower-level assemblies are ignored. Information about entering part parameters for these models appears in IEC TR 62380/RDF 2000 Part Parameters.

The Mechanical model is based on the Handbook of Reliability Prediction Procedures for Mechanical Equipment, Document No. NSWC-98/LE1. Developed under the direction of the United States Navy, this model supports failure rate calculations for various types of mechanical devices, including springs, bearings, seals, motors, brakes, clutches, and many more. This standard is the only one of its kind. For more information, see Mechanical Model.

MIL-HDBK-217 models are based on various publications of MIL-HDBK-217, Military Reliability Prediction of Electronic Equipment. This standard, the original for reliability predictions, provides component models for nearly every conceivable type of electronic device. Accepted and known worldwide, it is used by commercial companies and the defense industry. MIL-HDBK-217 models support the ability to perform parts count and parts stress predictions. Both F Notice 1 and 2 are supported. Information about entering part parameters for this model appears in MIL-HDBK-217 Part Parameters.

While NPRD and EPRD Libraries are not calculation models, they supply failure rates for thousands of parts. If the model you have selected does not support a failure rate calculation for a particular part, you can search the NPRD and EPRD Libraries to see if they contain failure rates for this part. For more information, see NPRD and EPRD Libraries.

The PRISM model is based on the PRISM methodology, which was released in March 2000. It deviates from traditional reliability prediction methodologies by allowing you to factor in component, assembly, and system test data. It also addresses system level design and manufacturing processes to refine the system prediction. In addition, component and system assessment models address not only operational aspects but also non-operational and/or dormant aspects of a part or system. Because its component models are based on failure rate data recorded in failures per million calendar hours, the failure rate units for this model uses failures per million calendar hours rather than failures per million operating hours. Information about entering part parameters for this model appears in PRISM Part Parameters.

The Siemens SN 29500 model is based on IEC 61709, Electronic Components - Reliability - Reference Conditions for Failure Rates and Stress Models for Conversion. It provides frequently updated failure rate data at reference conditions as well as parts count and parts stress predictions. The reference conditions adopted by this model are typical for the majority of applications of components in systems. If operating conditions differ significantly from reference conditions, this model supports converting the failure rate data at the reference conditions to actual operating conditions. Information about entering part parameters for this model appears in Siemens Part Parameters.

Telcordia models are based on various issues of the Telcordia document, Reliability Prediction Procedure for Electronic Equipment, Technical Reference SR-332. Prior issues, known as Bellcore models, were developed by AT&T Bell Lab, who modified MIL-HDBK-217 models to better reflect the failure rates that AT&T Bell Lab equipment was experiencing in the field. Like MIL-HDBK-217 models, these models include the ability to perform parts count or parts stress predictions. The Prediction module supports Telcordia Issues 1, 2, 3, and 4 as well as Bellcore Issues 4, 5, and 6. Unless a significant difference exists between Telcordia and Bellcore models, Telcordia is used generically to refer to all models. These models support various calculation methods that take into account burn-in, laboratory, and/or field data. For more information, see Telcordia Calculation Methods. Because of the popularity of these calculation methods with commercial companies, the Prediction module supports using them with all but a FIDES, IEC TR 62380, or RDF 2000 model. Information about entering part parameters for Telcordia and prior Bellcore models appears in Telcordia Part Parameters.