FIDES Standard Part Parameters
The following table describes the standard parameters required by FIDES models. The first two parameters, which are FIDES file selections, can be specified at the part level for most FIDES parts. Both the FIDES 2009 model for part stress analysis and the FIDES 2004 model typically support specifying all of the following parameters at the part level. However, for the FIDES 2009 Parts Count and Families Count models, you can specify only the first two parameters at the part level. You specify the other parameters in the Calculation Data pane for the parent assembly. For more information, see Calculation Data for FIDES Models.
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Parameter
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Type
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Description
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Application Factor
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File Selection
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The Prediction FIDES Application Factor file that you want to use to calculate the Pi application factor required by the FIDES model. You use the browse button for this field to select a file. If the part does not inherit or have a specified FIDES Application file, a default value of 3.2 is used for the Pi application factor. However, if an override value for this factor is specified in the Calculation Data pane for the parent assembly, then the override value is used instead. For more information, see Prediction FIDES Application Factor Files.
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Ruggedized Factor
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File Selection
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The Prediction FIDES Ruggedized Factor file that you want to use to calculate the Pi ruggedized factor required by the FIDES model. You use the browse button for this field to select a file. If the part does not inherit or have a specified FIDES Ruggedized file, a default value of 1.7 is used for the Pi ruggedized factor. However, if an override value for this factor is specified in the Calculation Data pane for the parent assembly, then the override value is used instead. For more information, see Prediction FIDES Ruggedized Factor Files.
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Placement
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Choice List
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Not required for the following FIDES part categories: Connector, COTS Board, Miscellaneous Subassembly, Printed Circuit Board, and Wired Board.
The influence of the device’s position in the equipment or system. Choices indicate the position of the device (in the interface or not) and the function in which the device participates (digital or analog). Choices are:
• Non-interface digital function
• Interface digital function
• Non-interface low level analog function
• Interface low level analog function
• Non-interface power analog function
• Interface power analog function
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QA Manufacturer
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Choice List
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The quality assurance level for the manufacturer of the device, depending on its part category/subcategory. For example, the values and choices might be:
• 3 - Above state of the art
• 2 - Equivalent to state of the art
• 1 - Below state of the art
• 0 - Considerably below state of the art
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QA Component
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Choice List
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The quality assurance level for the device, depending on its part category/subcategory. For example, the values and choices might be:
• 3 - Above state of the art
• 2 - Equivalent to state of the art
• 1 - Below state of the art
• 0 - Considerably below state of the art
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RA Component
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Choice List
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Required only for the following FIDES part categories: Discrete Semiconductors and Integrated Circuits.
The reliability level for the device. The choices and values are:
• 3- Very Reliable Level A
• 2 - Very Reliable Level B
• 1 - Reliable:
• 0 - Unreliable
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Experience Factor
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Choice List
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The experience level for the manufacturer of the device, depending on its part category/subcategory. For example, the values and choices might be:
• 4- Known manufacturer - Mature processes
• 3 - Known manufacturer - Processes not analyzed, Not mature
• 2 - Unknown manufacturer - Low volume production
• 1 - Prior disqualification - Field return problem
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