FIDES 2009 Parts Stress Prediction Data Fields

Windchill Risk and Reliability Desktop Help > Appendices > Prediction Data Exports > FIDES 2009 Parts Stress Prediction Data Fields

The FIDES 2009 model for parts stress analysis does not use the general part categories and subcategories. It use the part categories and subcategories specified in the FIDES 2009 standard, FIDES Guide 2009, Reliability Methodology for Electronic Systems , published by the FIDES Group. To make FIDES 2009 part categories and subcategories available for an assembly when FIDES 2009 is the calculation model, you must select FIDES as the part classification.

The following topics list the prediction data fields exported for part types supported by the FIDES 2009 model for parts stress analysis:

• Capacitors

• Connectors

• COTS Boards

• Discrete Semiconductors

• Inductors and Transforms

• Integrated Circuits

• Light Emitting Diodes

• Microwave Component

• Miscellaneous Subassemblies

• Optocouplers

• Piezoelectric Devices

• Printed Circuit Boards

• Relays

• Resistors

• Switches

• Wired Boards

If mechanical parts or software components are inserted in your parts list, see Mechanical Part Prediction Data Fields or Software Prediction Data Fields for the data fields exported for these parts.