Description
|
Package Size
|
Max Theta JC
|
---|---|---|
Flatpack (FP)
|
10, 14, 16, 18, 20, 24, 28 lead
|
22
|
Dual-In-Line Package (DIP)
|
8, 14, 16, 18, 20, 22, 24, 28, 40, 50, 64 lead
|
28
|
Can
|
8 lead
|
70
|
Rect. Leadless Chip Carrier (LCC)
|
10, 12 lead
|
65
|
Square Leadless Chip Carrier (LCC)
|
16, 20, 24, 28, 44, 52, 68, 84 terminal
18, 20, 28, 32 terminal
|
20
20
|
J Bend Leaded Chip Carrier (JCC)
|
44, 68, 84 terminal
|
20
|
Gullwing Leaded Chip Carrier (GCC)
|
44, 68, 84 terminal
|
20
|
Unformed-Lead Chip Carrier
|
84, 100, 132, 144, 172, 196 terminal
|
20
|
Pin Grid Array (PGA)
|
81, 100, 121, 144, 169, 196, 225, 256, 289, 324, 361, 400 pin
|
20
|
Package Type (Ceramic Only)
|
Die Area > 14,400 sq mil
|
Worst Case Default
|
---|---|---|
Dual-In-Line
|
11
|
28
|
Flat Package
|
10
|
22
|
Chip Carrier
|
10
|
20
|
Pin Grid Array
|
10
|
20
|
Can
|
--
|
70
|