The following figure shows the questions shown for the FIDES 2009 model for parts stress analysis when the FIDES part category/subcategory combination is Integrated Circuit/ASIC. These process grade questions are shown at the bottom of the Prediction Data pane. You answer them to generate a ΠProcess_ASIC factor that grades development and design methodologies as well as the manufacturing processes for this FIDES part. This Pi factor value can range from 1 for the best process to 4 for the worst process. If you do not answer these questions, the default value of 2.5 is used. For more information, see the FIDES 2009 standard, FIDES Guide 2009, Reliability Methodology for Electronic Systems.