Group
|
MIL-STD-883 Screen/Test (Note 3)
|
Point Valuation
|
---|---|---|
1(#)
|
TM 1010 (Temperature Cycle, Condition B Minimum) and TM 2001 (Constant Acceleration, Condition B Minimum) and TM 5004 (or 5008 for Hybrids) (Final Electricals at Temp Extremes) and TM 1014 (Seal Test, Condition A, B, or C) and TM 2009 (External Visual)
|
50
|
2(#)
|
TM 1010 (Temperature Cycle, Condition B Minimum) or TM 2001 (Constant Acceleration, Condition B Minimum) TM 5004 (or 5008 for Hybrids) (Final Electricals at Temp Extremes) and TM 1014 (Seal Test, Condition A, B, or C) and TM 2009 (External Visual)
|
37
|
3
|
Pre-Burn in Electricals TM 1015 (Burn-in B-Level/S-Level) and TM 5004 (or 5008 for Hybrids) (Post Burn-in Electricals at Temp Extremes)
|
30 (B Level) 36 (S Level)
|
4(#)
|
TM 2020 Pind (Particle Impact Noise Detection)
|
11
|
5
|
TM 5004 (or 5008 for Hybrids) (Final Electricals at Temp Extremes)
|
11 (~)
|
6
|
TM 2010/17 (Internal Visual)
|
7
|
7(#)
|
TM 1014 (Seal Test, Condition A, B, or C)
|
7 (%)
|
8
|
TM 2012 (Radiography)
|
7
|
9
|
TM 2009 (External Visual)
|
7 (%)
|
10
|
TM 5007/5013 (GaAs) (Wafer Acceptance)
|
1
|
11
|
TM 2023 (Non-Destructive Bond Pull)
|
1
|