Field | Description |
---|---|
Diagonal, hybrid | The distance between the furthest pins in millimeters in the hybrid. |
Mounting substrate | The material used for the mounting substrate. Choices are: • Cu/Invar/Cu • Epoxy Glass • Flexible • PTFE Glass |
Substrate | The material used for the substrate. Choices are: • Alumina • Epoxy • Kovar |
Number of external connections | The number of external connections to the hybrid. |
Connection type | The type of connection. Choices are: • Double in line • Peripheral • Single in line |
Number of layers | The number of layers on the hybrid itself. |
Circuit surface area | The total usable area (cm2) for attaching circuits within the perimeter of the hybrid. |
Number of tracks | The total number of connections between components on the hybrid divided by two. |
Number of track crossovers | The number of times on the hybrid that track paths cross. Track crossings can interfere with the signal transmission, and can result in signal degradation. |
Track width | The distance across the tracks on the hybrid (in millimeters). Knowing the track width helps to determine the signal-carrying capacity of the track. Many different choices are available, including 0.56, 0.35, and more. |
Number of capacitors | The number of capacitors in use on the hybrid. |
Number of thick film resistors | The number of thick film resistors in use on the hybrid. |
Number of thin film resistors | The number of thin film resistors in use on the hybrid. |
Tolerance of resistors | The percentage by which the resistance value can alter from the specified value. Choices are: • 5% • 1% - 5% • < 1% |
Ambient temperature, hybrid | The ambient temperature in degrees C at which the hybrid functions properly. |