Hybrid Data for FIDES 2009 Model
When Hybrid is selected in the General Data pane for an assembly, the following form is shown in the Hybrid pane if the FIDES 2009 model is selected. Support for hybrids is not provided by the FIDES 2004 model.
The following table describes the data fields that appear in the Hybrid pane for the FIDES 2009 model.
Field | Description |
|---|---|
FIDES hybrid process grade | The process grade score that indicates how the design and manufacturing of the hybrid or multi-chip module influences its reliability. The default process grade of 2.5 is used when no further evaluation of the design and manufacturing process occurs. To increase the accuracy of reliability results, an evaluation should occur. Clicking the browse button for this field opens a window in which to complete this evaluation. For more information, see FIDES 2009 Hybrid Process Grades. |
FIDES placement | The influence of the device’s position in the equipment or system. Choices indicate the position of the device (in the interface or not) and the function in which the device participates (digital or analog). Choices are: • Non-interface digital function • Interface digital function • Non-interface low level analog function • Interface low level analog function • Non-interface power analog function • Interface power analog function |
Number of wires | The total number of wires, bumps, or strips inside the hybrid. |
FIDES hybrid wire type | The type of wiring. Choices are: • Wires and strips (aluminum and gold) • Bumps |
FIDES hybrid moulding | The type of encapsulation. Choice are: • Hermetic non-moulded circuit • Moulded circuit silicone type embedding • Moulded circuit polyurethane type embedding • Moulded circuit expoxy type embedding |
FIDES hybrid particle | Method for protecting against the presence of metallic particles in the hermetic housing. Choices are: • Moulded circuit or chip interconnection by Flip-Chip, with underfill • Non-moulded hermetic circuit presence of particle trap and gold wire • Non-moulded hermetic circuit presence of particle trap and aluminium wire or chip interconnection by Flip-Chip without underfill • Non-moulded hermetic circuit absence of particle trap and gold wire • Non-moulded hermetic circuit absence of particle trap and aluminium wire • The second and fourth choices apply to a wire or strip. |
FIDES hybrid substrate technology | The material of the substrate and its connection technology. Choices are: • Ceramic • Glass-epoxy - Through holes • Glass-epoxy - Blind holes • Glass-epoxy - Micro-via technology • Glass-epoxy - Pad on via technology |
FIDES hybrid class | The class of the hybrid. The value to the left of the slash (/) is the minimum width of the conductors, and the value to the right of the slash is the minimum space between conductors or pads. The units are μm. Choices are: • 800 / 800 • 500 / 500 • 310 / 310 • 210 / 210 • 150 / 150 • 125 / 125 • 100 / 100 |
FIDES hybrid substrate and case | The type of substrate and case. Choices are: • Hermetic ceramic case (cofired MCM case, …) • Alumina substrate in hermetic metal case • Alumina substrate with moulding • Alumina substrate, without case or moulding • Organic substrate (glass-epoxy) with hermetic metal case • Organic substrate (glass-epoxy) with moulding • Glass-epoxy substrate, without case or moulding |
FIDES hybrid mounting type | The way in which the device is mounted. This and the next several parameters are used to calculate a connection rigidity value. Choices are: • SMD component with soldered pins With copper or copper alloy pins • SMD component with soldered pins With Iron-Nickel alloy pins (alloy 42,Kovar...) • Component with soldered through pins With copper or copper alloy pins • Component with soldered through pins With Iron-Nickel alloy pins (alloy 42, Kovar...) • SMD component without soldered pin • Component without pin assembled by contact |
Pin cross section (mm^2) | The size of the pin’s cross section in mm2. |
Pin length (mm) | The length of the pin in millimeters. |
Diagonal, hybrid | The distance between the connections furthest from the module in millimeters. |
FIDES hybrid case nature | The material of which the case is made. Choices are: • Metal (Kovar) • Metal (Kovar) with Cu/In/Cu • Ceramic (alumina or co-sintered) • Ceramic (alumina or co-sintered) with Cu/In/Cu • Moulded (organic or ceramic substrate) • Moulded (organic or ceramic substrate) with Cu/In/Cu |
FIDES hybrid fixing mode | The movement permissible between the hybrid and the printed circuit. Choices are: • None (allows relative movement between the component and the printed circuit) • Flexible (allows limited movement of the component on its support) • Rigid (allows no or only small relative movement between the component and the printed circuit) |
Number of pins | The number of pins on the hybrid. |
Hybrid mass (gr) | The weight of the hybrid in grams. |
Number of layers | The number of layers on the hybrid itself. |
Number of tracks | The total number of connections between components on the hybrid divided by two. |
Circuit surface area | The total usable area (cm2) for attaching circuits within the perimeter of the hybrid. |
FIDES hybrid hermeticity | The type of case. Choices are: • Hermetic circuit (internal embedding or not) • Sealed cavity circuit (non-hermetic) • Moulded circuit |
FIDES Hybrid transfer type | The type of component transfer. Choices are: • By gluing (conducting glue) • By soldering (brazing) |
Hybrid junction temperature override (°C) | An override value to use in place of the junction temperature calculated for the hybrid. The units are degrees C for all temperatures. If you enter a value for this parameter, this value is used in place of a calculated junction temperature for the hybrid. |
Hybrid junction temperature rise (°C) | The junction temperature rise in degrees C to use in the calculation of the failure rate for the hybrid. |