Bubble Memory
|
Custom
|
EEPROM
|
GaAs Digital
|
---|---|---|---|
Exported fields are:
• Year of Manufacture
• Package Type
• Junction Temp Override
• Operating Power
• Temperature Rise
• Thermal Resistance
• Temp Method
• Case Temp
|
The only exported field is:
• Failure Rate
|
Exported fields are:
• Year of Manufacture
• Package Type
• Junction Temp Override
• Operating Power
• Temperature Rise
• Thermal Resistance
• Temp Method
• Case Temp
|
Exported fields are:
• Year of Manufacture
• Package Type
• Junction Temp Override
• Operating Power
• Temperature Rise
• Thermal Resistance
• Temp Method
• Case Temp
|
GaAs MMIC
|
Linear
|
Logic, CGA or ASIC
|
Memory
|
---|---|---|---|
Exported fields are:
• Year of Manufacture
• Package Type
• Junction Temp Override
• Operating Power
• Temperature Rise
• Thermal Resistance
• Temp Method
• Case Temp
|
Exported fields are:
• Year of Manufacture
• Package Type
• Junction Temp Override
• Operating Power
• Temperature Rise
• Thermal Resistance
• Temp Method
• Case Temp
|
Exported fields are:
• Year of Manufacture
• Package Type
• Junction Temp Override
• Operating Power
• Temperature Rise
• Thermal Resistance
• Temp Method
• Case Temp
|
Exported fields are:
• Year of Manufacture
• Package Type
• Junction Temp Override
• Operating Power
• Temperature Rise
• Thermal Resistance
• Temp Method
• Case Temp
|
Microprocessor
|
PAL, PLA
|
SAW - Surface Acoustic Wave
|
VHSIC/VLSI CMOS
|
---|---|---|---|
Exported fields are:
• Year of Manufacture
• Package Type
• Junction Temp Override
• Operating Power
• Temperature Rise
• Thermal Resistance
• Temp Method
• Case Temp
|
Exported fields are:
• Year of Manufacture
• Package Type
• Junction Temp Override
• Operating Power
• Temperature Rise
• Thermal Resistance
• Temp Method
• Case Temp
|
The only exported field is:
• Failure Rate
|
Exported fields are:
• Year of Manufacture
• Package Type
• Junction Temp Override
• Operating Power
• Temperature Rise
• Thermal Resistance
• Temp Method
• Case Temp
|