Integrated Circuits

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Integrated Circuits

The following tables list the prediction data fields exported for subcategories of the Integrated Circuits category when IEC TR 62380 is selected as the model. The fields exported vary, depending on the selection for Type.

BICMOS Integrated Circuits (silicon)	Bipolar Integrated Circuits (silicon)	Gallium Arsenide Integrated Circuits
Exported fields are: • Type • Package Type • Electrical Environment • Mounting Substrate • Year of Manufacture • # of Transistors • Units • Pins • Surface Mounted Device • Surface Mounted Package Type • Package Diagonal • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise	Exported fields are: • Type • Package Type • Electrical Environment • Mounting Substrate • Year of Manufacture • # of Transistors • Units • Pins • Surface Mounted Device • Surface Mounted Package Type • Package Diagonal • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise	Exported fields are: • Type • Package Type • Electrical Environment • Mounting Substrate • Year of Manufacture • # of Transistors • Units • Pins • Surface Mounted Device • Surface Mounted Package Type • Package Diagonal • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise

MOS Integrated Circuits (silicon): ASICs	MOS Integrated Circuits (silicon): digital, digital / linear, linear (standard)	MOS Memories (silicon)
Exported fields are: • Type • Package Type • Electrical Environment • Mounting Substrate • Year of Manufacture • # of Transistors • Units • Pins • Surface Mounted Device • Surface Mounted Package Type • Package Diagonal • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise	Exported fields are: • Type • Package Type • Electrical Environment • Mounting Substrate • Year of Manufacture • # of Transistors • Units • Pins • Surface Mounted Device • Surface Mounted Package Type • Package Diagonal • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise	Exported fields are: • Type • Package Type • Electrical Environment • Mounting Substrate • Year of Manufacture • # of Transistors • Units • Pins • Surface Mounted Device • Surface Mounted Package Type • Package Diagonal • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise