Blind Via
|
Micro-Via Technology
|
Pad On Via Technology
|
Via
|
---|---|---|---|
Exported fields are:
• Application Factor
• Ruggedized Factor
• QA Manufacturer
• QA Component
• Experience Factor
• # of Layers
• # of Mounting Points
• Min Conductor Width / Spacing
|
Exported fields are:
• Application Factor
• Ruggedized Factor
• QA Manufacturer
• QA Component
• Experience Factor
• # of Layers
• # of Mounting Points
• Min Conductor Width / Spacing
|
Exported fields are:
• Application Factor
• Ruggedized Factor
• QA Manufacturer
• QA Component
• Experience Factor
• # of Layers
• # of Mounting Points
• Min Conductor Width / Spacing
|
Exported fields are:
• Application Factor
• Ruggedized Factor
• QA Manufacturer
• QA Component
• Experience Factor
• # of Layers
• # of Mounting Points
• Min Conductor Width / Spacing
|