Integrated Circuits

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Integrated Circuits

The following tables list the prediction data fields exported for Integrated Circuit subcategories when FIDES 2009 is selected as the model.

ASIC	CPLD	Digital Circuit	DRAM
Exported fields are: • Application Factor • Ruggedized Factor • Ruggedized Factor • Placement • QA Manufacturer • QA Component • RA Component • Experience Factor • Technology • Type • Case Type • Pins • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise	Exported fields are: • Application Factor • Ruggedized Factor • Placement • QA Manufacturer • QA Component • RA Component • Experience Factor • Case Type • Pins • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise	Exported fields are: • Application Factor • Ruggedized Factor • Placement • QA Manufacturer • QA Component • RA Component • Experience Factor • Case Type • Pins • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise	Exported fields are: • Application Factor • Ruggedized Factor • Placement • QA Manufacturer • QA Component • RA Component • Experience Factor • Case Type • Pins • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise

DSP	EEPROM	EPROM	FLASH EEPROM
Exported fields are: • Application Factor • Ruggedized Factor • Placement • QA Manufacturer • QA Component • RA Component • Experience Factor • Case Type • Pins • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise	Exported fields are: • Application Factor • Ruggedized Factor • Placement • QA Manufacturer • QA Component • RA Component • Experience Factor • Case Type • Pins • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise	Exported fields are: • Application Factor • Ruggedized Factor • Placement • QA Manufacturer • QA Component • RA Component • Experience Factor • Case Type • Pins • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise	Exported fields are: • Application Factor • Ruggedized Factor • Placement • QA Manufacturer • QA Component • RA Component • Experience Factor • Case Type • Pins • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise

FPGA	FPGA (Anitfuse)	Linear Circuit	LV Circuit
Exported fields are: • Application Factor • Ruggedized Factor • Placement • QA Manufacturer • QA Component • RA Component • Experience Factor • Case Type • Pins • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise	Exported fields are: • Application Factor • Ruggedized Factor • Placement • QA Manufacturer • QA Component • RA Component • Experience Factor • Case Type • Pins • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise	Exported fields are: • Application Factor • Ruggedized Factor • Placement • QA Manufacturer • QA Component • RA Component • Experience Factor • Case Type • Pins • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise	The only exported field is: • Failure Rate

Microcontroller	Microprocessor	Mixed Circuit
Exported fields are: • Application Factor • Ruggedized Factor • Placement • QA Manufacturer • QA Component • RA Component • Experience Factor • Case Type • Pins • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise	Exported fields are: • Application Factor • Ruggedized Factor • Placement • QA Manufacturer • QA Component • RA Component • Experience Factor • Case Type • Pins • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise	Exported fields are: • Application Factor • Ruggedized Factor • Placement • QA Manufacturer • QA Component • RA Component • Experience Factor • Case Type • Pins • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise

Mixed LV Circuit	PAL (BiPolar)	SRAM
Exported fields are: • Application Factor • Ruggedized Factor • Placement • QA Manufacturer • QA Component • RA Component • Experience Factor • Case Type • Pins • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise	Exported fields are: • Application Factor • Ruggedized Factor • Placement • QA Manufacturer • QA Component • RA Component • Experience Factor • Case Type • Pins • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise	Exported fields are: • Application Factor • Ruggedized Factor • Placement • QA Manufacturer • QA Component • RA Component • Experience Factor • Case Type • Pins • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise