Integrated Circuits

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Integrated Circuits

The following tables list the prediction data fields exported for Integrated Circuit subcategories when FIDES 2004 is selected as the model.

CPLD	Digital Circuit	DRAM	EEPROM
Exported fields are: • Application Factor • Ruggedized Factor • Placement • QA Manufacturer • QA Component • RA Component • Experience Factor • Case Type • Pins • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise	Exported fields are: • Application Factor • Ruggedized Factor • Placement • QA Manufacturer • QA Component • RA Component • Experience Factor • Type • Case Type • Pins • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise	Exported fields are: • Application Factor • Ruggedized Factor • Placement • QA Manufacturer • QA Component • RA Component • Experience Factor • Case Type • Pins • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise	Exported fields are: • Application Factor • Ruggedized Factor • Placement • QA Manufacturer • QA Component • RA Component • Experience Factor • Case Type • Pins • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise

EPROM	FLASH EEPROM	FPGA	FPGA (Anitfuse)
Exported fields are: • Application Factor • Ruggedized Factor • Placement • QA Manufacturer • QA Component • RA Component • Experience Factor • Case Type • Pins • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise	Exported fields are: • Application Factor • Ruggedized Factor • Placement • QA Manufacturer • QA Component • RA Component • Experience Factor • Case Type • Pins • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise	Exported fields are: • Application Factor • Ruggedized Factor • Placement • QA Manufacturer • QA Component • RA Component • Experience Factor • Case Type • Pins • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise	Exported fields are: • Application Factor • Ruggedized Factor • Placement • QA Manufacturer • QA Component • RA Component • Experience Factor • Case Type • Pins • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise

Linear Circuit	LV Circuit	Mixed Circuit
Exported fields are: • Application Factor • Ruggedized Factor • Placement • QA Manufacturer • QA Component • RA Component • Experience Factor • Type • Case Type • Pins • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise	Exported fields are: • Application Factor • Ruggedized Factor • Placement • QA Manufacturer • QA Component • RA Component • Experience Factor • Case Type • Pins • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise	Exported fields are: • Application Factor • Ruggedized Factor • Placement • QA Manufacturer • QA Component • RA Component • Experience Factor • Case Type • Pins • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise

Mixed LV Circuit	PAL (BiPolar)	SRAM
Exported fields are: • Application Factor • Ruggedized Factor • Placement • QA Manufacturer • QA Component • RA Component • Experience Factor • Case Type • Pins • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise	Exported fields are: • Application Factor • Ruggedized Factor • Placement • QA Manufacturer • QA Component • RA Component • Experience Factor • Case Type • Pins • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise	Exported fields are: • Application Factor • Ruggedized Factor • Placement • QA Manufacturer • QA Component • RA Component • Experience Factor • Case Type • Pins • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise