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Parameter
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Type
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Description
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|---|---|---|
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Quality Level
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Choice List
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The quality screening level used in the manufacturing of the device. For more information, see Telcordia Quality Levels.
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Package Type
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Choice List
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Required only for the following subcategories: Chip, Elec (CWR) and Solid, Elec, Tant (CSR).
The type of package. Choices are:
• Hermetic
• Non-Hermetic
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|
Capacitance
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Real
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Required only for the following subcategories: Chassis Mount, Elec, Alum (CU, CUR); and Lead Mount, Elec, Alum (CE).
The capacitance value of the device. This parameter is used in conjunction with Units to enter the capacitance units.
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|
Units
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Choice List
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Required only for the following subcategories: Chassis Mount, Elec, Alum (CU, CUR); and Lead Mount, Elec, Alum (CE).
The units for the Capacitance value. Choices are:
• F (Farad)
• uF (micro Farad = F/1E6)
• nF (nano Farad = F/1E9)
• pF (pico Farad = F/1E12)
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Type
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Choice List
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Required only for the following subcategories: Chassis Mount, Elec, Alum (CU, CUR); Paper-Plastic (CQ, CQR, CPV); Piston, Variable (PC); Mica (CM, CMR); and Nonsolid, Elec, Tant (CL, CLR, CRL).
The type of device. Choices vary by subcategory.
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[Voltage Parameters]
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Not required if Method I Case 1 or Method I Case 2 is selected as the calculation method.
For other calculation methods, For more information, see Voltage Parameters.
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[Temperature Parameters]
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---
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Not required if Method I Case 1 or Method I Case 2 is selected as the calculation method.
For more information, see Basic Temperature Parameters.
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[Derating Parameters]
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For more information, see Derating Parameters.
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