|
Parameter
|
Type
|
Description
|
|---|---|---|
|
Design Life Cycle
|
Real
|
The design life cycle of the equipment in which the circuit board is operating.
|
|
Equipment Type
|
Choice List
|
The type of equipment in which the circuit board is operating. Many different choices are available.
|
|
Cycling Rate Override
|
Real
|
Generally, this field is left at #.## so that the cycling rate is calculated. Each equipment type is associated with a certain number of temperature cycles per hour. If you enter a value for this parameter, this value is used in place of a calculated cycling rate.
|
|
Max Joint Distance
|
Real
|
The distance from the center of the device to the furthest solder joint. The units are 0.001 inches.
|
|
Joint Height
|
Real
|
The solder joint height for leadless devices only. The units are mils. For Lead Configuration, you indicate the type of configuration. For leaded devices, 8 mils is used, regardless of what is entered in this field.
|
|
Board Substrate
|
Choice List
|
The substrate material of which the board is made. Many different choice are available. Choices include FR-4 items, Ceramic items, and more.
|
|
Package Substrate
|
Choice List
|
The type of package substrate material. Choices are:
• Plastic
• Ceramic
|
|
Lead Configuration
|
Choice List
|
The types of leads on the packages. Choices are:
• Leadless
• J or S Lead
• Gull Wing
|
|
[Temperature Parameters]
|
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|
For more information, see Comprehensive Temperature Parameters.
|
|
[Derating Parameters]
|
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|
For more information, see Derating Parameters.
|