|
Parameter
|
Type
|
Description
|
|---|---|---|
|
Complexity
|
Choice List [Parts Count also]
|
The number of active elements in the device. Active elements include transistors and diodes. Choices vary by subcategory:
|
|
Application
|
Choice List
|
Required only for the GaAS MMIC subcategory.
The type of application for the device. Choice are:
• Driver and High Power
• Low Noise and Low Power
• Unknown
|
|
Quality Level
|
Choice List
|
The quality screening level used in the manufacturing of the device. Choices are:
• S
• B
• B-1
• Commercial
If the device is screened to custom or intermediate programs, you can enter a Pi Q value directly in Pi Q Value. For more information, see MIL-HBDK-217 Quality Levels
|
|
Pins
|
Integer
|
The number of active pins in the package.
|
|
Package Type
|
Choice List
|
Indicates how the chip is packaged. Choices are:
• Can
• DIP, Glass Seal
• Flatpack
• Hermetic: DIPs, PGA, SMT
• Nonhermetic: DIPs, PGA, SMT
|
|
Years in Production
|
Choice List [Parts Count also]
|
The number of years the device has been in production. Choices are:
• >=2.0
• 1.5
• 1.0
• 0.5
• <=0.1
|
|
[Temperature Parameters]
|
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|
For more information, see Comprehensive Temperature Parameters.
|
|
[Derating Parameters]
|
---
|
For more information, see Derating Parameters.
|