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Parameter
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Type
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Description
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|---|---|---|
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Quality Level
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Choice List
|
The quality screening level used in the manufacturing of the device. Choices vary by subcategory. For more information, see MIL-HBDK-217 Quality Levels.
|
|
[Voltage Parameters]
|
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For more information, see Voltage Parameters.
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|
Capacitance
|
Real
|
Not required for the following part types: (CT), (CV), (CA, CP), and (CG).
The capacitance value of the device. This parameter is used in conjunction with Units.
|
|
Units
|
Choice List
|
Not required for the following part types: (CT), (CV), (CA,CP), and (CG).
The units for the Capacitance value. Choices are:
• F (Farad)
• uF (micro Farad = F/1E6)
• nF (nano Farad = F/1E9)
• pF (pico Farad = F/1E12)
|
|
Type
|
Choice List
|
Required only for the following part types: (CM, CMR), (CL, CLR, CRL), and (PC).
The type of device. Choices vary by subcategory.
|
|
Construction Type
|
Choice List [FN1 only]
|
Required only for the following part types: (CM, CMR), and (CL, CLR, CRL).
The construction type of the device. Choices vary by subcategory.
|
|
Series Resistance
|
Choice List (Ohms/Volt)
|
Required only for the following part types: (CWR) and (CSR).
The circuit resistance of the device. Choices are:
• 0.8
• 0.6 to 0.8
• 0.4 to 0.6
• 0.2 to 0.4
• 0.1 to 0.2
• 0 to 0.1
|
|
Configuration
|
Choice List [FN1 only]
|
Required only for the following part type: (CG).
The configuration of the device. Choices are:
• Fixed
• Variable
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|
Max Junction Temp
|
Choice List (Degrees C) [FN1 only]
|
Not required for the following part types: (CT), (CDR), (CY, CYR), (CE), (CL, CLR, CRL), (CA, CP), (CSR), (CRH), and (CC, CCR).
The maximum junction temperature, which is normally available in the manufacturer's databook. The device is flagged as overstressed if the sum of the temperature rise and subassembly temperature is greater than the maximum junction temperature.
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|
[Temperature Parameters]
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For more information, see Basic Temperature Parameters.
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[Derating Parameters]
|
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For more information, see Derating Parameters.
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