Integrated Circuits
The following tables list the prediction data fields exported for Integrated Circuit subcategories when PRISM is selected as the model.
Bubble Memory
Custom
EEPROM
GaAs Digital
Exported fields are:
Year of Manufacture
Package Type
Junction Temp Override
Operating Power
Temperature Rise
Thermal Resistance
Temp Method
Case Temp
The only exported field is:
Failure Rate
Exported fields are:
Year of Manufacture
Package Type
Junction Temp Override
Operating Power
Temperature Rise
Thermal Resistance
Temp Method
Case Temp
Exported fields are:
Year of Manufacture
Package Type
Junction Temp Override
Operating Power
Temperature Rise
Thermal Resistance
Temp Method
Case Temp
GaAs MMIC
Linear
Logic, CGA or ASIC
Memory
Exported fields are:
Year of Manufacture
Package Type
Junction Temp Override
Operating Power
Temperature Rise
Thermal Resistance
Temp Method
Case Temp
Exported fields are:
Year of Manufacture
Package Type
Junction Temp Override
Operating Power
Temperature Rise
Thermal Resistance
Temp Method
Case Temp
Exported fields are:
Year of Manufacture
Package Type
Junction Temp Override
Operating Power
Temperature Rise
Thermal Resistance
Temp Method
Case Temp
Exported fields are:
Year of Manufacture
Package Type
Junction Temp Override
Operating Power
Temperature Rise
Thermal Resistance
Temp Method
Case Temp
Microprocessor
PAL, PLA
SAW - Surface Acoustic Wave
VHSIC/VLSI CMOS
Exported fields are:
Year of Manufacture
Package Type
Junction Temp Override
Operating Power
Temperature Rise
Thermal Resistance
Temp Method
Case Temp
Exported fields are:
Year of Manufacture
Package Type
Junction Temp Override
Operating Power
Temperature Rise
Thermal Resistance
Temp Method
Case Temp
The only exported field is:
Failure Rate
Exported fields are:
Year of Manufacture
Package Type
Junction Temp Override
Operating Power
Temperature Rise
Thermal Resistance
Temp Method
Case Temp