Printed Circuit Boards

Windchill Risk and Reliability Desktop Help > Appendices > Prediction Data Exports > FIDES 2009 Families Count Prediction Data Fields > Printed Circuit Boards

The following table lists the prediction data fields exported for Printed Circuit Board subcategories when FIDES 2009 Families Count is selected as the model.

Blind Via	Micro-Via Technology	Pad On Via Technology	Via
Exported fields are: • Application Factor • Ruggedized Factor • Type • # of Mounting Points	Exported fields are: • Application Factor • Ruggedized Factor • Type • # of Mounting Points	Exported fields are: • Application Factor • Ruggedized Factor • Type • # of Mounting Points	Exported fields are: • Application Factor • Ruggedized Factor • Type • # of Mounting Points