Connections

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Connections

The following tables list the prediction data fields exported for Connection subcategories when MIL-HDBK-217 FN2 Parts Stress is selected as the model.

Board with Plated Thru Holes	General	IC Socket
Exported fields are: • Quality Level • Type • # of Circuit Planes • None • # of Wave Soldered PTHs • # of Hand Soldered PTHs • Adjust Connector Count	Exported fields are: • Quality Level • Pairing • Connector Type • # of Mating Cycles • Contact Gauge • Amps/Contact • Temperature Rise • Case Temp Override	Exported fields are: • Quality Level • # of Active Contacts • Type

Other Connection	PCB Edge	SMT Interconnect Assy
Exported fields are: • None • # Hand Soldered • # Crimped • # Welded • # Solderless Wrapped • # Wrapped and Soldered • # Clip Termination • # Reflow Soldered • # Spring Contact • # Terminal Block • Adjust Connector Count	Exported fields are: • Quality Level • Pairing • # of Mating Cycles • Contact Gauge • Amps/Contact • Temperature Rise • Case Temp Override	Exported fields are: • Design Life Cycle • Equipment Type • Cycling Rate Override • Max Joint Distance • Joint Height • Board Substrate • Package Substrate • Lead Configuration • Initial Temp Rise • Operating Power • Thermal Resistance • Temperature Rise • Case Temp Override