Integrated Circuits

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Integrated Circuits

The following tables list the prediction data fields exported for Integrated Circuit subcategories when MIL-HDBK-217 FN1 Parts Stress is selected as the model.

Bubble Memory	Custom	EEPROM	GaAs Digital
Exported fields are: • Type • Chips/Package • Dissipative Elements • Quality Level • Pi Q Value • # of Bits • Units • Pins • Years in Production • Reads/Write • Average Data Rate • Maximum Data Rate • Duty Cycle • Temperature Rise • Case Temp Override	The only exported field is: • Failure Rate	Exported fields are: • Type • Error Correction • Programming Cycles • System Lifetime (Hrs) • Quality Level • Pi Q Value • # of Bits • Units • Pins • Package Type • Years in Production • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise • Junction Temp Override	Exported fields are: • Complexity • Quality Level • Pi Q Value • Pins • Package Type • Years in Production • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise • Junction Temp Override

GaAs MMIC	Linear	Logic, CGA or ASIC	Memory
Exported fields are: • Complexity • Application • Quality Level • Pi Q Value • Pins • Package Type • Years in Production • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise • Junction Temp Override	Exported fields are: • Quality Level • Pi Q Value • # of Transistors • Pins • Package Type • Years in Production • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise • Junction Temp Override	Exported fields are: • Technology Type • Quality Level • Pi Q Value • # of Gates • Pins • Package Type • Years in Production • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise • Junction Temp Override	Exported fields are: • Type • Technology Type • Quality Level • Pi Q Value • # of Bits • Units • Pins • Package Type • Years in Production • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise • Junction Temp Override

Microprocessor	PAL, PLA	SAW - Surface Acoustic Wave	VHSIC/VLSI CMOS
Exported fields are: • Technology Type • Quality Level • Pi Q Value • Word Size • Pins • Package Type • Years in Production • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise • Junction Temp Override	Exported fields are: • Technology Type • Quality Level • Pi Q Value • # of Gates • Pins • Package Type • Years in Production • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise • Junction Temp Override	The only exported field is: • Quality Level	Exported fields are: • Type • Manufacturing Process • Feature Size • Dissipation Surface • ESD Susceptibility • Seal • Quality Level • Pi Q Value • Pins • Package Type • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise • Junction Temp Override