Integrated Circuits

Windchill Risk and Reliability Desktop Help > Appendices > Prediction Data Exports > MIL-HDBK-217 FN2 Parts Count Prediction Data Fields > Integrated Circuits

Integrated Circuits

The following tables list the prediction data fields exported for Integrated Circuit subcategories when MIL-HDBK-217 FN2 Parts Count is selected as the model.

Bubble Memory	Custom	EEPROM	GaAs Digital
Exported fields are: • Type • Chips/Package • Dissipative Elements • Quality Level • Pi Q Value • # of Bits • Units • Pins • Years in Production • Reads/Write • Average Data Rate • Maximum Data Rate • Duty Cycle	The only exported field is: • Failure Rate	Exported fields are: • Quality Level • Pi Q Value • # of Bits • Units • Years in Production	Exported fields are: • Complexity • Quality Level • Pi Q Value • Years in Production

GaAs MMIC	Linear	Logic, CGA or ASIC	Memory
Exported fields are: • Complexity • Quality Level • Pi Q Value • Years in Production	Exported fields are: • Quality Level • Pi Q Value • # of Transistors • Years in Production	Exported fields are: • Technology Type • Quality Level • Pi Q Value • # of Gates • Years in Production	Exported fields are: • Type • Technology Type • Quality Level • Pi Q Value • # of Bits • Units • Years in Production

Microprocessor	PAL, PLA	SAW - Surface Acoustic Wave	VHSIC/VLSI CMOS
Exported fields are: • Technology Type • Quality Level • Pi Q Value • Word Size • Years in Production	Exported fields are: • Technology Type • Quality Level • Pi Q Value • # of Gates • Years in Production	The only exported field is: • Quality Level	Exported fields are: • Type • Manufacturing Process • Feature Size • Dissipation Surface • ESD Susceptibility • Seal • Quality Level • Pi Q Value • Pins • Package Type