Light Emitting Diodes

Windchill Risk and Reliability Desktop Help > Appendices > Prediction Data Exports > FIDES 2009 Parts Count Prediction Data Fields > Light Emitting Diodes

The following table lists the prediction data fields exported for Light Emitting Diode subcategories when FIDES 2009 Parts Count is selected as the model.

SMD	Through Hole
Exported fields are: • Application Factor • Ruggedized Factor • Placement • QA Manufacturer • QA Component • RA Component • Experience Factor • Type • Current Rating • Case Type • # in Package • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise	Exported fields are: • Application Factor • Ruggedized Factor • Placement • QA Manufacturer • QA Component • RA Component • Experience Factor • Type • Case Type • # in Package • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise