Integrated Circuits

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Integrated Circuits

The following tables list the prediction data fields exported for Integrated Circuit subcategories when FIDES 2009 Parts Count is selected as the model.

ASIC	CPLD	Digital Circuit	DRAM
Exported fields are: • Application Factor • Ruggedized Factor • Type • Package Type • Pins	Exported fields are: • Application Factor • Ruggedized Factor • Package Type • Pins	Exported fields are: • Application Factor • Ruggedized Factor • Package Type • Pins	Exported fields are: • Application Factor • Ruggedized Factor • Package Type • Pins

DSP	EEPROM	EPROM	FLASH EEPROM
Exported fields are: • Application Factor • Ruggedized Factor • Package Type • Pins	Exported fields are: • Application Factor • Ruggedized Factor • Package Type • Pins	Exported fields are: • Application Factor • Ruggedized Factor • Package Type • Pins	Exported fields are: • Application Factor • Ruggedized Factor • Package Type • Pins

FPGA	FPGA (Anitfuse)	Linear Circuit	LV Circuit
Exported fields are: • Application Factor • Ruggedized Factor • Package Type • Pins	Exported fields are: • Application Factor • Ruggedized Factor • Package Type • Pins	Exported fields are: • Application Factor • Ruggedized Factor • Package Type • Pins	The only exported field is: • Failure Rate

Microcontroller	Microprocessor	Mixed Circuit
Exported fields are: • Application Factor • Ruggedized Factor • Package Type • Pins	Exported fields are: • Application Factor • Ruggedized Factor • Package Type • Pins	Exported fields are: • Application Factor • Ruggedized Factor • Package Type • Pins

Mixed LV Circuit	PAL (BiPolar)	SRAM
Exported fields are: • Application Factor • Ruggedized Factor • Package Type • Pins	Exported fields are: • Application Factor • Ruggedized Factor • Package Type • Pins	Exported fields are: • Application Factor • Ruggedized Factor • Package Type • Pins