Microwave Component

Windchill Risk and Reliability Desktop Help > Appendices > Prediction Data Exports > FIDES 2009 Families Count Prediction Data Fields > Microwave Component

Microwave Component

The following table lists the prediction data fields exported for Microwave Component subcategories when FIDES 2009 Families Count is selected as the model.

Integrated Circuit	Passive	Semiconductor
Exported fields are: • Application Factor • Ruggedized Factor • Placement • QA Manufacturer • QA Component • RA Component • Experience Factor • Type • Material • Case Type • Pins • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise	Exported fields are: • Application Factor • Ruggedized Factor • Placement • QA Manufacturer • QA Component • RA Component • Experience Factor • Type • CV Level • Operating Power • Power Ratio • Operating Voltage • Rated Voltage • Initial Temp Rise • Thermal Resistance • Junction- • Temperature Rise	Exported fields are: • Application Factor • Ruggedized Factor • Placement • QA Manufacturer • QA Component • RA Component • Experience Factor • Type • Secondary Type • Material • Case Type • Operating Voltage • Rated Voltage • Voltage Ratio • Initial Temp Rise • Operating Power • Thermal Resistance • Junction- • Temperature Rise