Light Emitting Diodes
The following table lists the prediction data fields exported for Light Emitting Diode subcategories when FIDES 2009 Families Count is selected as the model.
SMD
Through Hole
Exported fields are:
Application Factor
Ruggedized Factor
Placement
QA Manufacturer
QA Component
RA Component
Experience Factor
Type
Current Rating
Case Type
# in Package
Initial Temp Rise
Operating Power
Thermal Resistance
Junction-
Temperature Rise
Exported fields are:
Application Factor
Ruggedized Factor
Placement
QA Manufacturer
QA Component
RA Component
Experience Factor
Type
Case Type
# in Package
Initial Temp Rise
Operating Power
Thermal Resistance
Junction-
Temperature Rise