Printed Circuit Boards

The following table lists the prediction data fields exported for Printed Circuit Board subcategories when FIDES 2004 is selected as the model.

Blind Via	Micro-Via Technology	Pad On Via Technology	Via
Exported fields are: • Application Factor • Ruggedized Factor • QA Manufacturer • QA Component • Experience Factor • # of Layers • # of Mounting Points • Routing Class	Exported fields are: • Application Factor • Ruggedized Factor • QA Manufacturer • QA Component • Experience Factor • # of Layers • # of Mounting Points • Routing Class	Exported fields are: • Application Factor • Ruggedized Factor • QA Manufacturer • QA Component • Experience Factor • # of Layers • # of Mounting Points • Routing Class	Exported fields are: • Application Factor • Ruggedized Factor • QA Manufacturer • QA Component • Experience Factor • # of Layers • # of Mounting Points • Routing Class